Key Advantages：
Three-zone design ensures precise thermal shock simulation
Rapid temperature transition: ≤3–10 seconds
Wide range: -70°C to +200°C
High precision control: ±0.5°C stability
Continuous cyclic testing capability
Compliant with MIL-STD-810, IEC 60068, JESD22
Robust design for thousands of test cycles
Key Specifications of three zone thermal shock chamber：
| Serial number | Capacity ( m³ ) | 0.07 | 0.11 | 0.2 | 0.3 | |
| 1 | Model | Thermal Shock Test Chamber (3-Zone) | ETS70-40W | ETS110-40W | ETS200-40w | ETS300-40W |
| 2 | ETS200-55W | ETS300-55W | ||||
| 3 | ETS70-65W | ETS110-65W | ETS300-65W | |||
| 4 | Internal Dimension WxHxD (mm) | 410x460x370 | 650x460x370 | 650x460x670 | 970x460x670 | |
| 5 | External Dimension WxHxD (mm) | 1470x1860x1570 | 1710x1860x1570 | 1710x1860x1870 | 2030x1860x1870 | |
| 7 | Temperature Range of Testing zone | -40W(-D): (+60℃ to +150℃) - (0℃ to -40℃) -55W(-D): (+60℃ to +150℃) - (0℃ to -55℃) -65W(-D): (+60℃ to +150℃) - (0℃ to -65℃) | ||||
| 8 | Exposure Time of High Temperature | Preheating Temperature Range: +60°C to +200°C Heating Rate: +60°C to +200°C ≤ 20min | ||||
| 9 | Exposure Time of Low Temperature | Precooling Temperature Range: -75°C to 0°C Cooling Rate: From +20°C to -75°C ≤ 70min | ||||
| 10 | Temperature of Heat-storing Slot/ Heating Time（Recovery) | RT~200°C / About 30mins | ||||
| 11 | Temperature of Cool-storing Slot/ Cooling Time （Recovery) | RT~-70°C / About 45mins | ||||
| 12 | Temperature Recovery Time/ Conversion Time | ≤5min/≤5sec | ||||
| 13 | Temperature Fluctuatio n/Deviation/Uniformity | ≤ ± 0.5℃/≤ ± 2.0℃/≤ 2.0℃ | ||||
| 14 | Cooling System | Semi-hermetic double-stage compreor(Water-cooled type) Hermetic double-stage compressor (Air-cooled type) | ||||
| 15 | Accessories | Viewing window(special opfional) | ||||
| 16 | Performance Example( Satisfy test standard IEC60068-2-14) | |||||
| 17 | Rated power | 26kw | 29kw | 37kw | 37kw | |
| 18 | 38kw | 38kw | ||||
| 19 | 38kw | 42kw | 58kw | |||
| 20 | Power | AC380V: 3phase 5 lines : 50/60HZ | ||||
| 21 | Approx. Weight (Kg) | 1050 | 1150 | 1400 | 1470 | |
| 22 | ※1:Both the rate of temperature rising and reduction are the performance while high temperature chamber and low temperature chamber is running ※2:In center point ※2:Recovery condition:ambient temperature:+25℃,cooling water temperature:+25℃,power voltage:380VAC(1±10%) | |||||
Opening：
The Three-Zone Thermal Shock Chamber is engineered for evaluating product reliability under extreme and instantaneous temperature changes. By moving samples rapidly between three temperature zones—high, low, and test zones—it simulates severe thermal stress conditions that occur in real-world applications.
With temperature ranges from -70°C to +200°C and transition times as fast as seconds, this chamber is ideal for aerospace, automotive, electronics, and defense industries that demand high-reliability testing.
Working Principle：
The three-zone thermal shock system operates using separate high, low, and test chambers. Samples are shuttled rapidly between zones to create instant thermal stress, which is critical for detecting:
Material expansion/contraction mismatch
Solder joint cracking
Structural weakness in components
This is the main difference compared to two-zone or standard thermal cycling chambers.
Thermal Shock vs Thermal Cycling：
| Feature | Three-Zone Thermal Shock | Thermal Cycling |
|---|---|---|
| Temperature Transition | Instant | Gradual |
| Stress Type | Extreme | Controlled |
| Typical Application | Military, Aerospace | Electronics, PCB |
| Standard | MIL-STD, IEC | JESD22 |
Why Choose TestEQ：
Expertise in high-end environmental testing systems
Stable performance under extreme thermal stress
Advanced airflow & thermal balance technology
Custom engineering for military, aerospace, and semiconductor standards
Energy-efficient design reducing operational costs
Optional Configurations：
LN₂ cooling system (-196°C) for ultra-low temperature testing
Remote monitoring & IoT integration
Large-volume chambers up to 12,000L
Semiconductor testing optimization (JEDEC compliant)
Custom control systems for precise temperature profiles
Meet standard:
GJB150.5A-2009 Temperature shock test
GB/2424.13-2002 Temperature shock test
GJB360B-2009 Temperature shock test
GB2423.1-2008/IEC6008-2-1-2007 Low-temperature test methods
GB2423.2-2008 High-temperature test methods
GBT 10589-2008 Technical conditions for low-temperature test chambers
GBT 11158-2008 Technical conditions and specifications for high-temperature test chambers
FAQ：
What is a three-zone thermal shock chamber?
It is a test system with high, low, and test zones, designed to rapidly transfer samples between extreme temperatures for reliability testing.
What industries use three-zone thermal shock chambers?
Aerospace, defense, automotive electronics, semiconductors, and high-reliability materials testing.
How fast can it change temperature?
Typically ≤3–10 seconds, depending on chamber configuration.
What standards does it comply with?
Supports MIL-STD-810, IEC 60068, JESD22, and other international testing standards.
How to choose a three-zone thermal shock chamber?
Key factors: temperature range, transition time, chamber capacity, standard compliance, and application type.
Applications：
Semiconductor devices: reliability testing and JEDEC compliance
Aerospace & defense components: MIL-STD environmental validation
Automotive electronics: ECUs, sensors, and modules
PCB & solder joint fatigue testing
Military-grade equipment validation
Advanced materials and composites testing
Call To Action：
"Request a custom three-zone thermal shock testing solution today"
Our engineers will help you select the optimal chamber for your application.
We will contact you within 1 working day, please pay attention to the email with
the suffix "@test-eq.com".
We will contact you within 1 working day, please pay attention to the email with the suffix "@test-eq.com".
P.IVA: 91441900MAECQJHY37 Guangdong Test EQ Equipment Co., Ltd. | All Rights Reserved
