Key Advantages:
Capacity : 300 to 1000L(Customizable)
Instant thermal transition for extreme stress testing
High-precision temperature control (±0.5°C)
Two-zone or three-zone configuration options
Wide temperature range: -70°C to +200°C
Compliant with MIL-STD-810, IEC 60068, JESD22
Durable, high-reliability design for long-term testing
Customizable sizes and configurations for specific electronic components
Key Specifications:
| Serial number | Capacity ( m3 ) | 0.30 | 0.50 | 1.00 | |
| 1 | Model | Horizontal Thermal test chamber (2-Zone) | ETS300-40W-D | ETS500-40W-D | ETS1000-40W-D |
| 2 | ETS500-55W-D | ETS1000-55W-D | |||
| 3 | ETS300-65W-D | ||||
| 4 | Internal Dimension WxHxD (mm) | 800x620x600 | 1000x800x620 | 1200x1000x800 | |
| 5 | External Dimension WxHxD (mm) | 2150x1980x1700 | 2550x2140x1980 | 2950x2400x2250 | |
| 6 | Thermal Shock Temperature Range of Testing zone | Standard Thermal shock range: -40W(-D): (+60℃ to +150℃) - (0℃ to -40℃) -55W(-D): (+60℃ to +150℃) - (0℃ to -55℃)-65W(-D): (+60℃ to +150℃) - (0℃ to -65℃) Optional: -70W(-D): (+60℃ to +200℃) - (0℃ to -70℃) - for smaller capacity under 100L | |||
| 7 | Exposure Time of High/Low Temperature | Preheating Temperature Range: +60°C to +210°C Heating Rate: +60°C to +200°C ≤ 20min Precooling Temperature Range: -75°C to +20°C | |||
| 8 | Cooling Rate: From +20°C to -70°C ≤ 30min | Cooling Rate: From +20°C to -65°C ≤ 30min | Cooling Rate: From +20°C to -65°C ≤ 30min | ||
| 9 | Temperature of Heat-storing Slot/ Heating Time | RT~200°C / About 15mins | |||
| 10 | Temperature of Cool-storing Slot/ Cooling Time | RT~ -70°C / About 15mins | |||
| 11 | Temperature Recovery Time/Conversion Time | ≤0.5 to 3min/≤3sec | |||
| 12 | Precision Temp Control/ Distribution Accuracy | ±0.5℃/±2℃ | |||
| 13 | Cooling System | Semi-hermetic double-stage compreor(Water-cooled type) Hermetic double-stage compressor (Air-cooled type) | |||
| 14 | Accessories | Viewing window(special opfional) | |||
| 15 | Performance Example( Satisfy test standard IEC60068-2-14) | ||||
| 16 | Rated power | 35kw | 50kw | 80kw | |
| 17 | 55kw | 85kw | |||
| 18 | 48kw | ||||
| 19 | Power | AC380V: 3phase 5 lines : 50/60HZ | |||
| 20 | Approx. Weight (Kg) | 1650 | 2250 | 3250 | |
| 21 | ※1: Both the rate of temperature rising and reduction are the performance while high temperature chamber and low temperature chamber is running ※2: In center point ※3: Recovery condition:ambient temperature:+25℃, cooling water temperature:+25℃,power voltage:380VAC(1±10%) | ||||
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Introduction:
The Thermal Shock Test Chamber for Electronics is designed to evaluate the reliability of electronic components and assemblies under extreme and rapid temperature changes. By quickly transferring samples between hot and cold zones, it simulates the thermal stress experienced in real-world applications such as aerospace, automotive, and consumer electronics.
Temperature Range: -70°C to +200°C
Rapid Transition Time: ≤3–10 seconds
Purpose: Identify early-life failures, solder joint cracks, and material expansion mismatches
This chamber is ideal for Environmental Stress Screening (ESS), quality control, and product development of electronic devices.
Working Principle:
The thermal shock chamber operates with a two-zone or three-zone system:
High-temperature zone
Low-temperature zone
Test zone (optional in 3-zone systems)
The electronic sample is transferred rapidly between zones, producing instant thermal stress without gradual transition. This is the key difference from standard thermal cycling chambers.
Thermal Shock vs Thermal Cycling:
| Feature | Thermal Shock | Thermal Cycling |
|---|---|---|
| Temperature Transition | Instant | Gradual |
| Stress Type | Extreme | Controlled |
| Application | Military, electronics, materials | Electronics, PCBs |
| Standards | MIL-STD | JESD22, IEC 60068 |
Tip: For electronics, thermal shock testing ensures solder joints, PCB laminates, and sensitive components withstand rapid temperature changes
Why Choose TestEQ:
Industry-leading expertise in environmental testing systems
Advanced thermal balance and airflow technology
Stable performance under extreme conditions
Custom engineering solutions for electronics applications
Energy-efficient operation for continuous testing
Optional Configurations:
2-zone or 3-zone system
Liquid nitrogen (LN₂) boost for ultra-low temperatures
Large custom chamber volumes
Remote monitoring with IoT / Modbus integration
Semiconductor testing optimized for JEDEC standards
FAQ:
Q1: What is a thermal shock test chamber?
A thermal shock chamber evaluates how electronic components react to rapid and extreme temperature changes, helping identify early failures.
Q2: What is the difference between thermal shock and thermal cycling?
Thermal shock involves instant temperature transitions, while thermal cycling uses gradual temperature changes.
Q3: Which electronics can be tested in this chamber?
PCBs, semiconductor devices, automotive modules, aerospace components, and consumer electronics.
Q4: What standards does this chamber meet?
MIL-STD-810, IEC 60068, JESD22, and other global testing standards.
Q5: How to choose the right chamber for electronics testing?
Consider temperature range, transition speed, chamber size, test standards, and component type.
Designed to Meet and Exceed Global Aerospace Benchmarks:
Standards Expertise: Fully compliant with GJB150.5, RTCA/DO-160, MIL-STD-810, MIL-STD-202, and other critical aerospace/defense protocols.
Data Integrity: Precise control and logging ensure your test data is audit-ready and defensible, supporting certification and qualification processes.
Custom Profiles: TestEQ engineers can help develop and validate custom test profiles tailored to your specific mission profile requirements.
Applications:
This chamber is widely used in electronics testing for:
Semiconductor devices (JEDEC JESD22)
Printed circuit boards (PCBs) and solder joint fatigue analysis
Automotive electronics (ECUs, sensors, ADAS modules)
Aerospace and avionics components
Consumer electronics (smart devices, communication modules)
Military and defense electronic systems
Call to Action:
"Request a custom thermal shock testing solution for electronics today"
Our engineers will guide you in selecting the optimal chamber configuration for your applications.
We will contact you within 1 working day, please pay attention to the email with
the suffix "@test-eq.com".
We will contact you within 1 working day, please pay attention to the email with the suffix "@test-eq.com".
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