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Thermal Vacuum Cleaning System
Technical Specifications

TESTEQ Thermal Vacuum Cleaning System for High-Precision Semiconductor Components

Industry-Leading Contamination Removal for Lithography, Optics & Wafer Processing

This equipment adopts an innovative inclined sealing structure (patented design-Thermal Vacuum/Lithography/UHV). 

Through the gravity-adaptive cover plate and double-ring sealing ring interlocking technology, it can maintain a stable vacuum level (≤10⁻⁶ Pa), solving the problem of reduced cleaning efficiency caused by sealing failure in traditional equipment. 

It integrates a dual-fluid spray system (sodium hydroxide + deionized water), supporting non-destructive cleaning in a high-temperature (350℃) vacuum environment, avoiding thermal stress deformation.

 It is suitable for the maintenance of high-precision components such as mask plates, lens groups, and vacuum pump components of lithography machines, significantly improving chip yield and equipment lifespan.

Specifications

Technical Specifications

Vacuum Range: 10⁻³ to 10⁻⁷ Pa (configurable for EUV, DUV, and advanced packaging)

Temperature Range: 150°C to 450°C (precision-controlled for optics, metals, and coatings)

Gas Purging System: N₂, Ar, H₂, or custom mixes (0.1–0.5 MPa, pulsed/continuous flow)

Plasma-Assisted Cleaning (Optional): O₂, Ar plasma (50–300W) for organic/polymer removal

Ultrasonic Enhancement (Optional): 40–80 kHz for particle dislodgement (low-pressure safe)

Material Compatibility: Si/Mo mirrors, SiC, Al (≤200°C), stainless steel, ceramics

Process Monitoring: Real-time RGA (Residual Gas Analysis) & particle detection


InformationDetails
Inner dimensionW1200*H1000*D800mm (customize)
Exterior dimensionW2300*H2400*D2000mm (customize)
vacuum pump air removal systemScrew pump + Roots pump + Molecular pump
Temperature rangeRT~200℃,Temperature error≤±5℃
Temperature control accuracy:±1℃
Raising speedUnder working vacuum, the time for heating from room temperature to 200℃ shall not exceed 1 hour
Effective working volumeW1000×D1000×H800mm,With shielding plate or customize
Power380V  50HZ  55KW


Product Features

A fully automatic thermal vacuum cleaning equipment specially designed for components of lithography machines and mask plates. Through a high-temperature and low-pressure environment and non-contact dry cleaning technology, it can thoroughly remove nano-level contaminants (such as organic residues and particles), meeting the strict requirements for ultra-clean surfaces in semiconductor manufacturing, flat panel display, and integrated circuit fields. It supports multi-scenario cleaning of wafers, optical lenses, vacuum chambers, etc.

Feature:

Unmatched Cleaning Performance – Removes Sn residues (EUV), hydrocarbons, oxides, and sub-100nm particles for defect-free production.

Smart Process Control – Automated recipes with pressure/temperature profiling for repeatable results.

Multi-Technology Integration – Combine thermal, plasma, and ultrasonic cleaning in one system.

Non-Destructive Cleaning – Gentle on EUV multilayer optics, reticles, and delicate sensors.

SEMI & ISO-Compliant – Meets ISO Class 1 cleanliness standards with full traceability.

24/7 Production Ready – Designed for high-throughput semiconductor fabs with minimal downtime.

  

Critical Applications

1. EUV Lithography Systems

Mirror & Collector Optics Cleaning – Eliminates Sn droplets and carbon buildup.

Reticle & Pellicle Maintenance – Ensures zero mask defects.

Vacuum Chamber Conditioning – Prevents contamination in EUV source modules.

2. DUV Lithography & Advanced Packaging

Lens & Prism Decontamination – Stops haze formation.

Wafer Chuck & Stage Recovery – Restores optimal electrostatic clamping.

3. R&D & Failure Analysis

Prototype Surface Prep – Clean surfaces for SEM, TEM, XPS analysis.


Why Choose TESTEQ?

  Higher Yield – Reduces particle-related defects by >90% (verified in leading fabs).

 Longer Component Life – Extends service intervals for EUV nozzles, DUV lenses, and chucks.

  Faster ROI – Minimizes manual cleaning and requalification time.

  Custom Solutions – Tailored configurations for your specific components.


Request a Demo or Process Validation

TESTEQ systems are field-proven in top-tier semiconductor facilities. [Contact our team] to schedule a test with your components.

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  • Add: TESTEQ Science and Technology Park, No. 5, Wenzhou Road, Dongcheng Sub-district, Dongguan City, Guangdong Province, China

    Whatsapp(Phone): +8613310826672

    Tel: +86-0769-85914911

    Web: www.chamber-testing.com

    E-mail: Kris@test-eq.com

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