Test EQ

A fully automatic thermal vacuum cleaning equipment specially designed for components of lithography machines and mask plates. Through a high-temperature and low-pressure environment and non-contact dry cleaning technology, it can thoroughly remove nano-level contaminants (such as organic residues and particles), meeting the strict requirements for ultra-clean surfaces in semiconductor manufacturing, flat panel display, and integrated circuit fields. It supports multi-scenario cleaning of wafers, optical lenses, vacuum chambers, etc.

Feature:

1.  Military-grade sealing performance

   55° inclined furnace opening + trapezoidal groove sealing ring design, with a vacuum leakage rate lower than 5×10⁻¹⁰ Pa·m³/s, far exceeding industry standards.

2. Intelligent cleaning process

   Four-stage automatic cycle: Vacuum degassing → High-temperature pyrolysis → Pulse spraying → Residue-free drying, supporting the cleaning of wafers (≤ 12 inches) and non-planar devices

3. Green and low-energy consumption design

   Closed-loop liquid circuit system (with waste liquid recovery module), water consumption reduced by 70%; UHV-compatible design, reduced helium consumption

4. Multi-scenario compatibility

   The modular cavity can be adapted for components of the lithography machine (light source module, mask table), semiconductor etching chamber, and cleaning of photovoltaic coating carriers.

5. Real-time monitoring system

   An internal particle counter (with 0.1μm accuracy) and a film thickness sensor are integrated, generating a cleaning report that complies with the ISO 14644-1 Class 2 cleanliness standard.