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Thermal Shock Test Chamber for Rapid Temperature Change Testing

Key Advantages:

Capacity : 300 to 1000L(Customizable)

Instant thermal transition for extreme stress testing

High-precision temperature control (±0.5°C)

Two-zone or three-zone configuration options

Wide temperature range: -70°C to +200°C

Compliant with MIL-STD-810, IEC 60068, JESD22

Durable, high-reliability design for long-term testing

Customizable sizes and configurations for specific electronic components


Key Specifications:

Serial

number

Capacity ( m3 )0.30 0.50 1.00 
1Model

 Horizontal Thermal

 test chamber 

(2-Zone)

ETS300-40W-DETS500-40W-DETS1000-40W-D
2
ETS500-55W-DETS1000-55W-D
3ETS300-65W-D

4Internal Dimension
WxHxD (mm)
800x620x6001000x800x6201200x1000x800
5External Dimension
WxHxD (mm)
2150x1980x1700 2550x2140x19802950x2400x2250       
6

Thermal Shock

 Temperature Range

of  Testing zone

Standard  Thermal shock range: 

 -40W(-D): (+60℃  to +150℃) - (0℃ to -40℃)

-55W(-D): (+60℃  to  +150℃) - (0℃ to -55℃)

-65W(-D): (+60℃  to +150℃) - (0℃  to -65℃)

Optional: 

-70W(-D): (+60℃  to +200℃) - (0℃  to -70℃) 

- for smaller capacity under 100L

7Exposure Time of
High/Low Temperature
 Preheating Temperature Range: +60°C to +210°C

Heating Rate:  +60°C to +200°C ≤  20min

Precooling Temperature Range: -75°C to +20°C

8

Cooling Rate: From

+20°C to -70°C 

≤ 30min

Cooling Rate: From 

+20°C to -65°C 

≤ 30min

Cooling Rate: 

From 

+20°C to -65°C 

≤ 30min

9Temperature of
Heat-storing Slot/
Heating Time
RT~200°C / About 15mins
10Temperature
of Cool-storing Slot/
Cooling Time
RT~ -70°C / About 15mins
11Temperature Recovery
Time/Conversion Time
≤0.5 to 3min/≤3sec
12

Precision Temp Control/ 

Distribution Accuracy

±0.5℃/±2℃
13Cooling SystemSemi-hermetic double-stage compreor(Water-cooled type)
 Hermetic double-stage compressor (Air-cooled type)
14AccessoriesViewing window(special opfional)
15Performance Example( Satisfy test standard IEC60068-2-14)
16Rated power35kw50kw80kw
17
55kw85kw
1848kw

19PowerAC380V: 3phase 5 lines : 50/60HZ
20Approx. Weight (Kg)165022503250
21※1: Both the rate of temperature rising and reduction are the performance
           while high temperature chamber and low temperature chamber is running
※2: In center point
※3: Recovery condition:ambient temperature:+25℃,

           cooling water temperature:+25℃,power voltage:380VAC(1±10%)

48h Flash Deal! Request Your Custom Quote Now


Introduction:

The Thermal Shock Test Chamber for Electronics is designed to evaluate the reliability of electronic components and assemblies under extreme and rapid temperature changes. By quickly transferring samples between hot and cold zones, it simulates the thermal stress experienced in real-world applications such as aerospace, automotive, and consumer electronics.

  • Temperature Range: -70°C to +200°C

  • Rapid Transition Time: ≤3–10 seconds

  • Purpose: Identify early-life failures, solder joint cracks, and material expansion mismatches

This chamber is ideal for Environmental Stress Screening (ESS), quality control, and product development of electronic devices.


Working Principle:

The thermal shock chamber operates with a two-zone or three-zone system:

The electronic sample is transferred rapidly between zones, producing instant thermal stress without gradual transition. This is the key difference from standard thermal cycling chambers.


Thermal Shock vs Thermal Cycling:

FeatureThermal ShockThermal Cycling
Temperature TransitionInstantGradual
Stress TypeExtremeControlled
ApplicationMilitary, electronics, materialsElectronics, PCBs
StandardsMIL-STDJESD22, IEC 60068

Tip: For electronics, thermal shock testing ensures solder joints, PCB laminates, and sensitive components withstand rapid temperature changes


Why Choose TestEQ:

  • Industry-leading expertise in environmental testing systems

  • Advanced thermal balance and airflow technology

  • Stable performance under extreme conditions

  • Custom engineering solutions for electronics applications

  • Energy-efficient operation for continuous testing


Optional Configurations:

  • 2-zone or 3-zone system

  • Liquid nitrogen (LN₂) boost for ultra-low temperatures

  • Large custom chamber volumes

  • Remote monitoring with IoT / Modbus integration

  • Semiconductor testing optimized for JEDEC standards


Designed to Meet and Exceed Global Aerospace Benchmarks:

  • Standards Expertise: Fully compliant with GJB150.5, RTCA/DO-160, MIL-STD-810, MIL-STD-202, and other critical aerospace/defense protocols.

  • Data Integrity: Precise control and logging ensure your test data is audit-ready and defensible, supporting certification and qualification processes.

  • Custom Profiles: TestEQ engineers can help develop and validate custom test profiles tailored to your specific mission profile requirements.


Internal Linking Module

Recommended Equipment

Designed for gradual temperature cycling and ESS reliability testing, this chamber provides programmable ramp rates up to 25°C/min and is widely used for semiconductor, PCB, and automotive electronics qualification.

Suitable for long-term climatic testing under controlled temperature and humidity conditions. It is commonly used for electronic components, sensors, batteries, and reliability verification.


Related Standards

IEC 60068-2-14 specifies environmental test methods for rapid temperature changes and thermal shock testing, helping manufacturers evaluate material expansion and structural reliability.

JEDEC JESD22 defines reliability qualification methods for semiconductor devices, including thermal cycling, thermal shock, and accelerated stress testing.


Related Resources

Learn how thermal shock testing works, common failure mechanisms, and why rapid temperature transitions are essential for improving electronic product reliability.

Discover how HAST testing accelerates moisture and temperature stress to evaluate semiconductor packages, IC devices, and electronic assemblies for long-term reliability.


FAQ:

Q1: What is a thermal shock test chamber?
A thermal shock chamber evaluates how electronic components react to rapid and extreme temperature changes, helping identify early failures.


Q2: What is the difference between thermal shock and thermal cycling?
Thermal shock involves instant temperature transitions, while thermal cycling uses gradual temperature changes.


Q3: Which electronics can be tested in this chamber?
PCBs, semiconductor devices, automotive modules, aerospace components, and consumer electronics.


Q4: What standards does this chamber meet?
MIL-STD-810, IEC 60068, JESD22, and other global testing standards.


Q5: How to choose the right chamber for electronics testing?
Consider temperature range, transition speed, chamber size, test standards, and component type.

Applications:

This chamber is widely used in electronics testing for:

  • Semiconductor devices (JEDEC JESD22)

  • Printed circuit boards (PCBs) and solder joint fatigue analysis

  • Automotive electronics (ECUs, sensors, ADAS modules)

  • Aerospace and avionics components

  • Consumer electronics (smart devices, communication modules)

  • Military and defense electronic systems


Call to Action:


Need a Reliable Thermal Shock Testing Solution for Electronics?

From semiconductor devices and PCBs to automotive electronic components, TestEQ provides high-performance thermal shock chambers designed to meet IEC 60068-2-14 and JEDEC reliability requirements.

Whether you need a standard system or a customized solution, our engineering team can help you select the right chamber size, temperature range, basket transfer mode, and automation options for your application.


Request Your Thermal Shock Chamber Solution

Tell us your testing requirements, including specimen size, temperature range, and applicable standards. Our engineers will recommend the most suitable thermal shock test chamber for your electronics reliability applications.

"Request a custom thermal shock testing solution for electronics today


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