Key Advantages：
Temperature Range: -70°C to +200°C
Transition Time: ≤10 seconds
Capacity: 23L – 1000L (customizable)
Temperature Stability: ±0.5°C
Cycle Life: >2000 cycles continuous testing
Control System: PLC + Touch Screen
Supports continuous cyclic testing
Key Specifications of Thermal Shock Test Chamber：
| Serial number | Capacity ( m3 ) | 0.023 | 0.06 | 0.125 | |
| 1 | Model | Thermal Shock Test Chamber (2-Zone) | ETS23-40W-D | ETS60-40W-D | ETS125-40W-D |
| 2 | ETS60-55W-D | ETS125-55W-D | |||
| 3 | ETS23-65W-D | ETS60-65W-D | ETS125-65W-D | ||
| 4 | Internal Dimension WxHxD (mm) | 270x310x270 | 380x370x430 | 470x410x650 | |
| 5 | External Dimension WxHxD (mm) | 700x1534x1800 | 875x1895x1970 | 970x1895x2350 | |
| 6 | Temperature Range of Testing zone | Thermal shock Temperature range ： -40W(-D): (+60℃ to +150℃) - (0℃ to -40℃) -55W(-D): (+60℃ to +150℃) - (0℃ to -55℃)-65W(-D): (+60℃ to +150℃) - (0℃ to -65℃) Optional: -70W(-D): (+60℃ to +200℃) - (0℃ to -70℃) | |||
| 7 | Exposure Time of High/Low Temp | Preheating Temperature Range: +60°C to +200°C Heating Rate: +60°C to +200°C ≤ 20min | |||
| 8 | Precooling Temperature Range: -75°C to 0°C Thermal shock Cooling Rate: From +20°C to -70°C ≤ 30min | ||||
| 9 | Temperature of Heat-storing Slot/ Heating Time | RT~200°C / About 15mins | |||
| 10 | Temperature of Cool-storing Slot/ Cooling Time | RT~-70°C / About 15mins | |||
| 11 | Temperature Recovery Time/Conversion Time | ≤0.5 to 3min/≤3sec | |||
| 12 | Precision Temp Control /Distribution Accuracy | ±0.5℃/±2℃ | |||
| 13 | Cooling System | Semi-hermetic double-stage compreor(Water-cooled type) Hermetic double-stage compressor (Air-cooled type) | |||
| 14 | Accessories | Viewing window(special opfional) | |||
| 15 | Performance Example( Satisfy test standard IEC60068-2-14) | ||||
| 16 | Rated power | 13kw | 16kw | 20kw | |
| 17 | 18kw | 22kw | |||
| 18 | 14kw | 22kw | 24kw | ||
| 19 | Power | AC380V: 3phase 5 lines : 50/60HZ | |||
| 20 | Approx. Weight (Kg) | 520 | 960 | 1300 | |
| 21 | ※1: Both the rate of temperature rising and reduction are the performance while high temperature chamber and low temperature chamber is running ※2: In center point ※3: Recovery condition:ambient temperature:+25℃, cooling water temperature:+25℃,power voltage:380VAC(1±10%) | ||||
The Thermal Shock Test Chamber is designed to evaluate product reliability under extreme and instantaneous temperature changes. By rapidly transferring test samples between high and low temperature zones, it simulates severe thermal stress conditions found in real-world environments.
With temperature ranges from -70°C to +200°C and transition times as fast as seconds, this chamber is ideal for electronics, aerospace, automotive, and military testing applications.
What is Thermal Shock Testing?
Thermal shock testing is a reliability evaluation method that exposes products to extreme and rapid temperature transitions between hot and cold environments. The purpose is to identify material stress failures such as:
Solder joint cracking
Thermal expansion mismatch
Delamination in PCB structures
Seal and adhesive failure
This method is widely used in aerospace, automotive electronics, semiconductors, and battery systems.
Thermal Shock Test Chamber Working Principle
Thermal shock chambers typically use:
2-zone system:
Hot chamber (+60°C to +200°C)
Cold chamber (-65°C to -80°C)
3-zone system:
Hot zone
Cold zone
Ambient transfer zone
Test samples are rapidly transferred between zones, achieving:
Transition time: ≤3–10 seconds
Thermal stress: instantaneous gradient loading
Thermal Shock vs Thermal Cycling：
| Item | Thermal Shock | Thermal Cycling |
|---|---|---|
| Transition | Instant | Gradual |
| Stress Level | Very High | Moderate |
| Failure Detection | Early-stage defects | Fatigue failure |
| Application | Aerospace, IC, PCB | General reliability |
Designed for High-Reliability Testing：
Thermal shock testing is essential for identifying:
• Material expansion mismatch failures
• Solder joint cracking
• Component structural weaknesses
• Early-life product failures
This makes it critical for high-reliability industries such as aerospace, defense, and semiconductors.
Why TestEQ Thermal Shock Chamber：
TestEQ thermal shock systems are designed with:
High-speed thermal transition technology
Energy-efficient refrigeration system
Modular chamber design
Long-cycle durability (>2000 cycles)
Custom engineering support for OEM testing needs
How to choose a thermal shock chamber?
Key factors include:
• Temperature range
• Transition time
• Chamber size
• Test standards
• Product type
Optional Configurations：
• 2-zone or 3-zone thermal shock system
• Liquid nitrogen (LN₂) cooling (up to -196°C)
• Large-volume custom chambers
• Remote monitoring (Modbus / IoT integration)
• Semiconductor testing mode (JEDEC optimized)
Industry Standards Compliance
Thermal shock testing complies with international reliability standards:
IEC 60068-2-14 (Environmental Testing)
MIL-STD-810H (Environmental Engineering)
JESD22-A104 (Temperature Cycling)
ASTM D3574 (Material durability testing)
FAQ：
1.What is a thermal shock test chamber?
A thermal shock test chamber evaluates how products respond to sudden and extreme temperature changes by rapidly transferring them between hot and cold environments.
2.What is the difference between thermal shock and thermal cycling?
Thermal shock uses instant temperature transitions, while thermal cycling uses gradual changes over time.
3.What industries use thermal shock testing?
Industries include aerospace, automotive, electronics, defense, and materials science.
4.What standards does this chamber comply with?
It supports MIL-STD-810, IEC 60068, JESD22, and other global testing standards.
5.What is the difference between 2-zone and 3-zone systems?
2-zone uses direct transfer, 3-zone includes intermediate buffer for higher precision.
6.What temperature range is typical?
-65°C to +200°C depending on configuration.
Internal Linking Module
For users who are comparing thermal shock test systems or planning a full environmental test setup, you may also consider the following related equipment:
Horizontal Thermal Shock Test Chamber(Applicable for large-sized samples and high uniformity testing requirements)
Temperature Humidity Test Chamber(For long-term environmental reliability and climate cycle testing)
This thermal shock test chamber is widely used to meet international reliability and qualification standards:
IEC 60068-2-14（Change of temperature / thermal shock testing standard）
MIL-STD-810（Environmental engineering considerations and laboratory tests）
Learn more about thermal shock testing principles, maintenance, and application guidance:
Thermal Shock Test Chamber Maintenance Guide（Equipment Maintenance and Life Optimization Technology Guide）
How to Choose an Environmental Test Chamber（Selection Method and Engineering Guide for Environmental Test Chambers）
Applications：
This thermal shock chamber is widely used in:
Semiconductor testing (JEDEC JESD22 reliability validation)
Aerospace & defense systems (MIL-STD environmental testing)
Automotive electronics (ECU, sensors, control modules)
PCB & solder joint fatigue testing
Military equipment validation
Advanced materials and composites testing
Call To Action：
Request a Thermal Shock Testing Solution
Not sure which configuration is right for your application?
TestEQ engineering team can help you define the optimal thermal shock testing system based on your:
Test standard requirements (IEC / MIL / JEDEC)
Sample size and material type
Temperature range and cycle conditions
Industry application scenario
We provide full engineering support from selection to system integration.
"Request a custom thermal shock testing solution today." Our engineers will help you select the optimal configuration for your application.
We will contact you within 1 working day, please pay attention to the email with
the suffix "@test-eq.com".
We will contact you within 1 working day, please pay attention to the email with the suffix "@test-eq.com".
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