Key Advantages：
Capacity : 23 to 125L
Temperature Range: -65℃ to +200℃
Preheating Temperature Range: +60℃ to +200℃
Heating Rate: +60℃to +200℃ ≤20min
Precooling Temperature Range: -78℃ to 0℃
Cooling Rate: +20℃to -75℃ ≤70min
Durable design with 2000+ test cycle reliability
Supports continuous cyclic testing
Key Specifications of Thermal Shock Test Chamber：
| Serial number | Capacity ( m3 ) | 0.023 | 0.06 | 0.125 | |
| 1 | Model | Thermal Shock Test Chamber (2-Zone) | ETS23-40W-D | ETS60-40W-D | ETS125-40W-D |
| 2 | ETS60-55W-D | ETS125-55W-D | |||
| 3 | ETS23-65W-D | ETS60-65W-D | ETS125-65W-D | ||
| 4 | Internal Dimension WxHxD (mm) | 270x310x270 | 380x370x430 | 470x410x650 | |
| 5 | External Dimension WxHxD (mm) | 700x1534x1800 | 875x1895x1970 | 970x1895x2350 | |
| 6 | Temperature Range of Testing zone | Thermal shock Temperature range ： -40W(-D): (+60℃ to +150℃) - (0℃ to -40℃) -55W(-D): (+60℃ to +150℃) - (0℃ to -55℃)-65W(-D): (+60℃ to +150℃) - (0℃ to -65℃) Optional: -70W(-D): (+60℃ to +200℃) - (0℃ to -70℃) | |||
| 7 | Exposure Time of High/Low Temp | Preheating Temperature Range: +60°C to +200°C Heating Rate: +60°C to +200°C ≤ 20min | |||
| 8 | Precooling Temperature Range: -75°C to 0°C Thermal shock Cooling Rate: From +20°C to -70°C ≤ 30min | ||||
| 9 | Temperature of Heat-storing Slot/ Heating Time | RT~200°C / About 15mins | |||
| 10 | Temperature of Cool-storing Slot/ Cooling Time | RT~-70°C / About 15mins | |||
| 11 | Temperature Recovery Time/Conversion Time | ≤0.5 to 3min/≤3sec | |||
| 12 | Precision Temp Control /Distribution Accuracy | ±0.5℃/±2℃ | |||
| 13 | Cooling System | Semi-hermetic double-stage compreor(Water-cooled type) Hermetic double-stage compressor (Air-cooled type) | |||
| 14 | Accessories | Viewing window(special opfional) | |||
| 15 | Performance Example( Satisfy test standard IEC60068-2-14) | ||||
| 16 | Rated power | 13kw | 16kw | 20kw | |
| 17 | 18kw | 22kw | |||
| 18 | 14kw | 22kw | 24kw | ||
| 19 | Power | AC380V: 3phase 5 lines : 50/60HZ | |||
| 20 | Approx. Weight (Kg) | 520 | 960 | 1300 | |
| 21 | ※1: Both the rate of temperature rising and reduction are the performance while high temperature chamber and low temperature chamber is running ※2: In center point ※3: Recovery condition:ambient temperature:+25℃, cooling water temperature:+25℃,power voltage:380VAC(1±10%) | ||||
The Thermal Shock Test Chamber is designed to evaluate product reliability under extreme and instantaneous temperature changes. By rapidly transferring test samples between high and low temperature zones, it simulates severe thermal stress conditions found in real-world environments.
With temperature ranges from -70°C to +200°C and transition times as fast as seconds, this chamber is ideal for electronics, aerospace, automotive, and military testing applications.
Working Principle：
The thermal shock chamber operates using a two-zone or three-zone system:
High-temperature chamber
Low-temperature chamber
Test zone (optional in 3-zone systems)
The test sample is rapidly transferred between zones, creating instant thermal stress without gradual transition, which is the key difference from thermal cycling.
| Feature | Thermal Shock | Thermal Cycling |
|---|---|---|
| Transition Speed | Instant | Gradual |
| Stress Type | Extreme | Controlled |
| Application | Military, materials | Electronics, PCB |
| Standard | MIL-STD | JESD22 |
Designed for High-Reliability Testing：
Thermal shock testing is essential for identifying:
• Material expansion mismatch failures
• Solder joint cracking
• Component structural weaknesses
• Early-life product failures
This makes it critical for high-reliability industries such as aerospace, defense, and semiconductors.
Why Choose TestEQ：
• Proven expertise in high-end environmental testing systems
• Advanced thermal balance & airflow technology
• Stable performance under extreme conditions
• Custom engineering for military & aerospace standards
• Energy-efficient design reducing operational cost
Optional Configurations：
• 2-zone or 3-zone thermal shock system
• Liquid nitrogen (LN₂) cooling (up to -196°C)
• Large-volume custom chambers
• Remote monitoring (Modbus / IoT integration)
• Semiconductor testing mode (JEDEC optimized)
FAQ：
What is a thermal shock test chamber?
A thermal shock test chamber evaluates how products respond to sudden and extreme temperature changes by rapidly transferring them between hot and cold environments.
What is the difference between thermal shock and thermal cycling?
Thermal shock uses instant temperature transitions, while thermal cycling uses gradual changes over time.
What industries use thermal shock testing?
Industries include aerospace, automotive, electronics, defense, and materials science.
What standards does this chamber comply with?
It supports MIL-STD-810, IEC 60068, JESD22, and other global testing standards.
How to choose a thermal shock chamber?
Key factors include:
• Temperature range
• Transition time
• Chamber size
• Test standards
• Product type
Applications：
This thermal shock chamber is widely used in:
Semiconductor testing (JEDEC JESD22 reliability validation)
Aerospace & defense systems (MIL-STD environmental testing)
Automotive electronics (ECU, sensors, control modules)
PCB & solder joint fatigue testing
Military equipment validation
Advanced materials and composites testing
"Request a custom thermal shock testing solution today." Our engineers will help you select the optimal configuration for your application.
We will contact you within 1 working day, please pay attention to the email with
the suffix "@test-eq.com".
We will contact you within 1 working day, please pay attention to the email with the suffix "@test-eq.com".
P.IVA: 91441900MAECQJHY37 Guangdong Test EQ Equipment Co., Ltd. | All Rights Reserved
